Offers ultra-thin wafer dicing, diamond blades and grinding wheels for dicing thin silicon materials, or cutting heavy substrates such as ceramics and quartz.
We manufacture a variety of compact CNC lathes specializing in small part turning. We have created products that possess three major elements: Compact Footprints, Value Pricing, World Class Components
Specializing in the development and manufacture of systems for determining the optimal yield of a rough stone, and laser systems for marking and cutting rough stones.